CLC 15-150 A/B

A two component, heat cure epoxy system specifically developed for use on instrument and power transformers. The cured material exhibits excellent thermal stability and thermal cycling endurance. Product meets UL 94-HB flammability requirements. CLC 15-150 A/B

CLR 1020 / CLH 6021

Semi-flexible epoxy adhesive and casting system. An unfilled, semi-flexible two component epoxy system. Its low mixed viscosity makes it suitable for potting and encapsulating electronic components. CLR 1020 / CLH 6021

CLR 1026 / CLH 6021

Low viscosity, semi-flexible. An unfilled, semi-flexible two component epoxy system. Its low mixed viscosity makes it suitable for potting and encapsulating electronic components. CLR 1026 / CLH 6021

CLS 9611

A low viscosity, single component, epoxy potting and encapsulating compound. The product has excellent stability and good adhesion to a wide range of substrates. This product meets UL 94-HB flammability requirements. Heat Cure Single Component semi-flexible epoxy potting and encapsulating system. Product is suitable for potting ferrites and pressure sensitive components in electrical and electronic applications. CLS 9611

CLS 9616

Heat Cure. Single Component semi-flexible epoxy potting and encapsulating system. Product is suitable for potting ferrites and pressure sensitive components in electrical and electronic applications. Low viscosity. The product has excellent stability and good adhesion to a wide range of substrates. This product meets UL94-HB flammability requirements. CLS 9616

XRD 1018 / XHD 1019

1:1 Mix Ratio, 130°C Operating, General Purpose, Low cost. A two component, room temperature cure semi-flexible, flame retardant, epoxy system. The system was developed for potting/casting of electrical and electronic components. Its use of non-abrasive fillers and convenient 1 to 1 ratio by volume, make it ideal for use in machine dispensing equipment. This product meets UL94-V0 in house flammability testing. XRD 1018 / XHD 1019